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Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

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Schematic showing different scenarios in electroplating. (a) faster

Huiqin LING, Shanghai Jiao Tong University, Shanghai, SJTU, State Key Laboratory of Metal Matrix Composites

PDF) Thermal stresses and deformations of Cu pillar flip chip BGA package: Analyses and measurements

3D Reconstruction and Characterization of Polycrystalline Microstructures Using a FIB–SEM System

The effect of lanthanum chloride on the electrocrystallization behavior of cobalt and grain refinement in deposition layers

Mechanical properties of Cu pillar flip chip package

3D Reconstruction and Characterization of Polycrystalline Microstructures Using a FIB–SEM System

Materials, Free Full-Text

Linear Sweep Voltammetric Study on the Copper Electrodeposition of Though-Silicon-Vias

Effect of die/substrate thickness ratio on Al pad stresses, under a

Enhanced electromigration resistance through grain size modulation in copper interconnects